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MicroSeal™
is synonymous with high yield.
Traditional seals with hard,
low-compliance, low-rebound characteristics, often leak so it is
difficult to obtain first-pass leak free assembly.
A
MicroSeal is different.
The
patented 316 L Double Melt Stainless Steel “soft seal”
process delivers exceptional plastic forming characteristics.
However, that’s not all. MicroSeal’s unique structural
elasticity provides the highest rebound, resulting in positive
sealing every time.
MicroSeal
is the lowest compression seal on the market. In fact, it
requires 20% less compression force than traditional designs.
“I-beam” type seals require tremendous load to perform
properly. This results in a crushed seal, which breaks off
particles into the process gas. MicroSeal spreads the load over a
radius surface resulting in a smooth surface finish. As a result,
MicroSeal will not damage the surface of the mating component or
introduce particle contamination.
MicroSeal’s
unique single point sealing design eliminates virtual leaks
caused by other seals resulting in faster pump down times.
The
result? As the first seal designed exclusively for rigorous
semiconductor requirements, MicroSeal offers you the highest first
pass assembly yield. High yield also means high reliability and
repeatability.
View
Product Catalog
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